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Gear Shaper Fin

Dec 11, 2019

In the heat dissipation requirements have been raised again and again today, the Japanese began to think of the use of thin and dense heat dissipation fins and heat dissipation floor with great pressure for chimera. This technology can be combined and matched with copper, aluminum fin and copper, aluminum bottom plate at will, and effectively avoid the malpractice of new thermal resistance caused by uneven heat conduction of various welding solder paste in the welding process. Allows customers to have more options and a diversity of thermal solutions. However, due to the particularity of its processing, there is still the problem of high cost in mass production.